Nowadays, microelectromechanical systems (MEMS) represent a well-established class of miniaturized devices integrating both mechanical and electrical components onto the same silicon board, fabricated together via photolithography-based process, which enables small device footprint, high sensing/actuating performances, low-power consumption, and mass production. MEMS devices, with particular reference to inertial sensors, are commonly applied in a variety of fields, ranging from consumer electronics to automotive industry, and have enabled novel functions and opportunities of the systems where they have been applied (e.g., screen rotation in mobile phones). However, they are still scarcely used in high-demanding applications, such as aerospace, because of insufficient sensitivity and stability, stemming from technological limitations affecting current fabrication strategies.

In this research project, novel technological solutions and mechanisms will be sought to develop MEMS inertial sensors based on Silicon-On-Insulator (SOI) wafer micromachining to enable high sensitivity and low noise, compared to standard devices. Different layouts will be developed and their mechanical and electro-mechanical performance compared through both analytical and numerical models, based on Finite Elements Method (FEM). The optimized layouts will be then fabricated and experimentally validated.